Researchers pioneer next-generation AI semiconductors with ‘thermal constraining’ technique
A research team led by Professor Taesung Kim from the School of Mechanical Engineering at Sungkyunkwan University has developed a technology that precisely controls the internal structure of semiconductors using heat, much like stamping out “bungeoppang” (fish-shaped pastry) in a mold. The team report that this approach improves the performance of next-generation artificial intelligence (AI) hardware. With this technology, complex AI computations can be processed more quickly using significantly less electricity than before. The findings are published in the journal ACS Nano.
Tandem solar cells based on perovskite semiconductors convert sunlight to electricity more efficiently than conventional silicon solar cells. In order to make this technology ready for the market, further improvements with regard to stability and manufacturing processes are required.
A multidisciplinary team has created a new fabrication technique for fully foldable robots that can perform a variety of complex tasks without relying on semiconductors.
Simon Fraser University computing science assistant professor Jason Peng is leading a research team that is raising motion simulation technology to the next level—and using the game of tennis to showcase just how real virtual athletes' moves can be.