Researchers pioneer next-generation AI semiconductors with ‘thermal constraining’ technique
A research team led by Professor Taesung Kim from the School of Mechanical Engineering at Sungkyunkwan University has developed a technology that precisely controls the internal structure of semiconductors using heat, much like stamping out “bungeoppang” (fish-shaped pastry) in a mold. The team report that this approach improves the performance of next-generation artificial intelligence (AI) …